Metal smart card with dual interface capability
US9390366B1 · kind B1 · utility
78Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2015 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jul 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15313
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A dual interface smart card having a metal layer includes an IC module, with contacts and RF capability, mounted on a plug, formed of non RF impeding material, between the top and bottom surfaces of the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. The resultant card can have contact and contactless operating capability and an entirely smooth external metal surface except for the contacts of the IC module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.