Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
US9390852B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jul 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a multilayer ceramic electronic part to be embedded in a board, the multilayer ceramic electronic part including: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; first and second external electrodes formed on the respective end portions of the ceramic body, and a third external electrode formed on first and second main surfaces of the ceramic body, wherein an outermost first internal electrode among the first internal electrodes is connected to the first and second external electrodes through at least one first via, and the second internal electrodes are connected to the third external electrode through at least one second via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.