Tape attaching apparatus and tape attaching method
US9390948B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2015 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Nov 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tape attaching apparatus includes: a chamber having an airtight space formed therein; a rubber sheet that partitions the airtight space into first and second airtight spaces and has an upper sheet on which a wafer is placed; a tape frame that holds a tape above the rubber sheet; and first and second supply/exhaust tubes that switch pressurization and depressurization of the first and second airtight spaces. In pressurizing the second airtight space and expanding the rubber sheet to lift the wafer to be attached to the tape, after bringing the first and second airtight spaces into a vacuum state, the wafer is attached to the tape while an amount of pressurization of the second airtight space is controlled to change an expansion rate of the rubber sheet from a low speed to a high speed stepwisely.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.