Semiconductor packages including heat exhaust part
US9391009B2 · kind B2 · utility
7Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | May 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.