Molding package assembly and molding material
US9391049B2 · kind B2 · utility
5Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Dec 5, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molding package assembly is provided, which includes a substrate and first and second molding packages stacked on the substrate. Each of the first and second molding packages has a semiconductor element, an anti-warping structure disposed around a periphery of the semiconductor element, a molding material encapsulating the semiconductor element and the anti-warping structure, and a protection layer formed on the semiconductor element, the molding material and the anti-warping structure. The anti-warping structure facilitates to prevent warping of the molding package assembly during a molding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.