Substrate arrangement
US9391147B2 · kind B2 · utility
0Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2015 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Mar 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7624
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate arrangement comprising a substrate having a surface configured to receive, by epitaxy, an epitaxial layer of semiconducting material, the substrate comprising a laminate having a handle layer and a seed layer, the seed layer having a crystal orientation arranged to receive the epitaxial layer and the handle layer having a crystal orientation different to the seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.