Vapor deposition method, vapor deposition device and organic EL display device
US9391275B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2011 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | May 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vapor deposition source (60), a plurality of control plates (80) and a vapor deposition mask (70) are disposed in this order. A substrate (10) is moved relative to the vapor deposition mask in a state in which the substrate and the vapor deposition mask are spaced apart at a fixed interval. Vapor deposition particles (91) discharged from a vapor deposition source opening (61) of the vapor deposition source pass through neighboring inter-control plate spaces (81) and mask openings (71) formed in the vapor deposition mask, and then adhere to the substrate to form a coating film (90). At least a part of the coating film is formed by the vapor deposition particles that have passed through two or more different inter-control plate spaces. It is thereby possible to form a coating film in which edge blur and variations in the thickness are suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.