Antenna feed integrated on multi-layer PCB
US9391370B2 · kind B2 · utility
10Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2015 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jun 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A transmitter includes apparatus for integrating the antenna feed into a multilayer PCB. The apparatus includes an antenna element disposed over the multilayer PCB having slot openings that substantially overlap and that enable an RF signal to be coupled from a printed transmission line located on one of the multilayer PCB conductive layers. The multilayer PCB board hosts at least one transceiver unit and a baseband unit such that the antenna feed, transceiver and baseband units are integrated on a single multilayer PCB board without degradation of antenna bandwidth and efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.