Patent · US Active

Power management in multi-die assemblies

US9391453B2 · kind B2 · utility

3Cited by

0References

29Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Guido Droege · Braunschweig, DE
Andre Schaefer · Hersbruck, DE
Uwe Zillmann · Braunschweig, DE

Key dates

Filing date	Jun 26, 2013
Grant date	Jul 12, 2016
Priority date	—
Expiry date	Dec 21, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19104
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An apparatus such as heterogeneous device includes at least a first die and a second die. The apparatus further includes a first inductive element, a second inductive element, and switch control circuitry. The switch control circuitry is disposed in the first die. The switch control circuitry controls current through the first inductive element to produce a first voltage. The first voltage powers the first die. The second inductive element is coupled to the first inductive element. The second inductive element produces a second voltage to power the second die. The first die and second die can be fabricated in accordance with different technologies and in which the first die and second die withstand different maximum voltages. A magnitude of the first voltage can be greater than a magnitude of the second voltage.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.