Low cost high strength surface mount package
US9392713B2 · kind B2 · utility
5Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Feb 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49111
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically insulating substrate has a plurality of apertures and an aspect ratio of about 10:1 or greater. The plurality of electrically and thermally conductive tabs is hermetically joined to a bottom surface of the electrically insulating substrate and at least one tab covers each of the apertures. The lid is hermetically joined to a top surface of the electrically insulating substrate proximate to a perimeter of the electrically insulating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.