Implantable antenna assemblies
US9393428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2012 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Mar 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49018
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An implantable antenna assembly includes a multilayer flexible printed circuit board comprising a first flexible substrate, second flexible substrate, and third flexible substrate. An inductor coil is formed by electrically conductive traces disposed on the first flexible substrate. A shield is formed by electrically conductive traces disposed on the second flexible substrate and third flexible substrate, the shield surrounding the inductor coil. A method for forming an implantable antenna assembly is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.