Methods and systems for aligning tooling elements of ultrasonic bonding systems
US9393641B2 · kind B2 · utility
2Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2011 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Dec 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.