Patent · US Active

Method for producing a dielectric layer on a component

US9394163B2 · kind B2 · utility

0Cited by

25References

13Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Charles Binninger · Antibes, FR
Christoph Eggs · Rattenkirchen, DE
Bruno Fuerbacher · Ingolstadt, DE
Ulrich Knauer · Munich, DE
Manfred Maisch · Unterhaching, DE
Helmut Zottl · Munich, DE

Key dates

Filing date	Apr 13, 2011
Grant date	Jul 19, 2016
Priority date	—
Expiry date	Nov 15, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/02834
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.