Hard film for cutting tool
US9394601B2 · kind B2 · utility
1Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Mar 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a hard film formed on a surface of a base material, the hard film being comprised of a nano multi-layered structure formed by stacking a thin layer A, a thin layer B a thin layer C in order of thin layers A-B-A-C from the base material or being comprised of a structure formed by repeatedly stacking the nano multi-layered structure at least twice, wherein the thin layer A is comprised of Ti1-xAlxN (0.3≦x≦0.7); the thin layer B is comprised of Al1-yCryN (0.3≦y≦0.7); and the thin layer C is comprised of MeN (where Me is any one of Nb, V, and Cr).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.