Source and arrangement for processing a substrate
US9394610B2 · kind B2 · utility
0Cited by
20References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 29, 2011 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Apr 28, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45591
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A source for feeding one or more gaseous precursors onto a surface of a substrate and an arrangement for processing the substrate by way of subjecting the surface of the substrate to alternately repetitive surface reactions of the precursors, the source including a gas feed member for feeding at least one or more precursors onto the surface of the substrate. The gas feed member is adapted rotatable about a rotation axis, the rotation axis being arranged to extend substantially parallel to the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.