Flooring system
US9394697B2 · kind B2 · utility
2Cited by
8References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 10, 2014 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Dec 10, 2034 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2203/065
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Described herein are flooring systems comprising: a first floor panel and a second floor panel, each of the first and second floor panels comprising: a top surface, a bottom surface, and a plurality of peripheral edges extending between the top and bottom surfaces; and a coupling surface formed on one peripheral edge; the coupling surfaces of the first and second floor panels being disposed proximate to each other forming a joint; and a thermally activated solid adhesive interspersed between the coupling surfaces of the first and second floor panel. Methods of installing these systems are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.