Backlight assembly and liquid crystal display using the same
US9395577B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2014 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Dec 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A backlight assembly and an LCD using the same are provided. The backlight assembly comprises: a light source, a conductive copper layer, a dielectric layer, a metallic printed circuit board and a heat sink. The dielectric layer is attached to one side surface of the metallic printed circuit board. The conductive copper layer is mounted on the dielectric layer. The light source and the heat sink are respectively connected to the conductive copper layer. The light source utilizes the conductive copper layer to conduct electricity and to conduct the heat to the heat sink. The backlight assembly has the heat sink connecting to the light source through the conductive copper layer to shorten the heat dissipating path of the light source and to enhance the heat-dissipating efficiency of the light source. Moreover, for the narrow frame, the heat sink is directly welded to the bent metallic printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.