Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component
US9395626B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Oct 31, 2012 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Dec 30, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0236
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1):wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.