Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module
US9397269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2015 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Apr 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8312
Abstract
Provided are a light emitting diode (LED) in which a conductive barrier layer surrounding a reflective metal layer is defined by a protective insulating layer, and a method of manufacturing the same. A reflection pattern including a reflective metal layer and a conductive barrier layer is formed on an emission structure in which a first semiconductor layer, an active layer, and a second semiconductor layer are formed. The conductive barrier layer prevents diffusion of a reflective metal layer and extends to a protective insulating layer recessed under a photoresist pattern having an overhang structure during a forming process. Accordingly, a phenomenon where the conductive barrier layer is in contact with sidewalls of the photoresist pattern having an over-hang structure and the reflective metal layer forms points is prevented. Thus, LED modules having various shapes may be manufactured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.