UV- and heat-resistant optoelectronic semiconductor component
US9397271B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 20, 2009 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Nov 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optoelectronic semiconductor component includes a connection carrier with at least two connection points and a carrier top that in a main side of the connection carrier, wherein the connection carrier configured with a silicone matrix with a fiber reinforcement, at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith, an annular potting body includes a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, and a glass body comprising a glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space between the semiconductor chip and the potting body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.