Light emitting device package
US9397274B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2012 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Nov 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
Embodiments disclose a light emitting device package including an insulating layer, a first lead frame and a second lead frame disposed on the insulating layer electrically separate from each other, a light emitting device disposed on the second lead frame electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer and a lens which encloses the light emitting device, wherein the insulating layer has an end portion projected beyond at least one of an end portion of the first lead frame and an end portion of the second lead frame, to form an opened region which exposes the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.