Devices and methods for cooling components on a PCB
US9398682B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2014 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Aug 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/081
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.