Substrate structure
US9398690B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Sep 8, 2014 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | Sep 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate structure includes a first substrate, a plurality of first bonding pads and a connecting layer. The first substrate has an element configuration area and a peripheral area. The peripheral area is disposed around the element configuration area. The first bonding pads are configured spacing at the peripheral area, and a gap is provided between two adjacent first bonding pads. The connecting layer is disposed on the first substrate and covers the first bonding pads and the gaps. The part of the connecting layer close to the element configuration area is configured with a plurality of first arc edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.