Patent · US Active

Laser cutting method optimized in terms of mass defect per unit length

US9399270B2 · kind B2 · utility

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Key dates

Filing dateOct 28, 2011
Grant dateJul 26, 2016
Priority date
Expiry dateJul 21, 2033

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG21D1/003
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The invention relates to an optimized laser cutting method for cutting a part from a material by means of a cutting system comprising: a laser source for producing a laser beam having a certain power; and a cutting head comprising an end nozzle for passage of a cutting laser beam, said method being characterized in that it comprises a step of determining the cutting power Pd such that: Pd=Max(Popt;λe) where Max is the mathematical operator of the maximum, Popt is an optimal power of the laser beam of the cutting system, which is predetermined in accordance with the part to be cut, and/or with cutting parameters and/or with system parameters, to minimize the mass defect per unit length of the part when the part is being cut, λ is a leading coefficient representing the number of kW required for cutting the part per mm of the thickness of the part, and e is the thickness of the part in mm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.