MEMS package and a method for manufacturing the same
US9399574B2 · kind B2 · utility
0Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2015 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Feb 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.