Methods and systems for bonding multiple wafers
US9399596B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2013 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Sep 3, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2027/0178
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure provides methods and systems for bonding multiple wafers. An example system may include a sealable chamber with a first and second substantially vertical post positioned inside of the sealable chamber. The system may also include a first latch connected to the first post via a first pin, wherein the first pin allows the first latch to rotate about the first pin. The system may also include a second latch similarly configured to the first latch. The system may also include a base plate positioned between the first and second posts. The base plate is arranged such that when a first wafer rests on the base plate and a second wafer rests on the first and second latches, moving the base plate from a first position to a second position causes a top surface of the first wafer to contact a bottom surface of the second wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.