Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same
US9399725B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2010 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Nov 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this.A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.