Refurbishing copper and indium containing alloy sputter targets and use of such targets in making copper and indium-based films
US9399816B2 · kind B2 · utility
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1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2011 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | May 16, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a method of refurbishing sputter targets comprising: providing a sputter target comprising a temperature sensitive alloy, having regions depleted of material; providing a powder having a first phase comprising the desired temperature sensitive alloy onto the surface; and pressing the powder onto the surface to form a refurbished target, at temperatures lower than that which would damage the temperature sensitive alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.