Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
US9399824B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Dec 9, 2013 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Jun 30, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.