Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
US9401466B2 · kind B2 · utility
4Cited by
13References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2013 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Apr 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method for manufacture of wire bondable and solderable surfaces on noble metal electrodes. The noble metal electrodes are activated by depositing a seed layer of palladium or a palladium alloy layer by electroless plating at 60 to 90° C. Next, an intermediate layer is deposited onto the seed layer followed by deposition of the wire bondable and/or solderable surface finish layer(s) onto the intermediate layer. This method is particularly suitable in the production of optoelectronic devices such as light emitting diodes (LEDs).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.