Thin-film piezoelectric material element, method of manufacturing the same, head gimbal assembly, hard disk drive, ink jet head, variable focus lens and sensor
US9401469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2015 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Jan 10, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/03
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin-film piezoelectric material element includes a lower electrode film, a piezoelectric material film, and an upper electrode film, the lower electrode film, the piezoelectric material film and the upper electrode film are laminated sequentially. An upper surface of the piezoelectric material film is a concavity and convexity surface having a convex part and a concave part, the convex part is a curved surface convexly projected, and the concave part is a curved surface concavely hollowed, the upper electrode film is formed on the concavity and convexity surface. The thin-film piezoelectric material element has a stress balancing film formed with a material having an internal stress capable of cancelling an element stress, the stress balancing film is formed on the upper electrode film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.