Transparent conductive film, electronic device, and method for manufacturing electronic device
US9401490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2011 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Jan 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a transparent conductive film which is low in terms of surface resistivity and high in terms of transparency.The transparent conductive film according to the present invention includes an adhesive conductive layer in openings of a conductive metal mesh layer provided on at least one surface of a transparent base material, wherein In addition, the present invention provides an electronic device having the foregoing transparent conductive film and a method for manufacturing an electronic device including forming a photoelectric conversion layer on an anodic layer and sticking the conductive layer of the transparent conductive film and a surface of the photoelectric conversion layer to each other at a temperature at which the foregoing conductive adhesive composition is softened or higher.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.