Semiconductor module
US9402311B2 · kind B2 · utility
1Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2013 |
| Grant date | Jul 26, 2016 |
| Priority date | — |
| Expiry date | Oct 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.