Collagen gel for bonding porous collagen-based materials with non-porous collagen-based materials
US9402709B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2011 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Aug 4, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/26
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The invention discloses a process for fabricating a biomaterial, comprising: a) joining a porous collagen based-material with a non-porous collagen based-material by applying a controlled amount of a bonding layer of a gel comprising collagen to a bonding surface of the non-porous collagen based-material, and contacting a surface of the porous collagen based-material with the gel applied to the bonding surface to partially hydrate a section of the porous material at the interface between the materials; b) drying the gel to dry to bond the materials together; and c) cross-linking the collagens in the bonding layer. Also disclosed are biomaterials and implants produced using the fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.