Method for forming an abrasive lapping plate
US9403258B2 · kind B2 · utility
2Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2013 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | May 2, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming a lapping plate. The method includes providing a lapping plate having a surface, spraying an adhesive onto the surface, spraying a slurry of abrasive particles and solvent onto the adhesive, and curing the adhesive to form an abrasive coating on the lapping plate. The adhesive may be, for example, epoxy, and the abrasive particles may be, for example, diamonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.