Resin composition and resin molded article
US9403979B2 · kind B2 · utility
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2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 20, 2015 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Feb 20, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes a polycarbonate resin, an aromatic polyester resin, a glycidyl group-containing polyethylene copolymer, and red phosphorus of which particle surfaces are covered with at least one of a thermosetting resin and an inorganic substance, and a volume average particle diameter is 15 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.