Wood adhesive
US9404025B1 · kind B1 · utility
1Cited by
9References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2014 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Apr 27, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J189/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive composition for manufacturing a composite wood product comprising an aqueous network of a formaldehyde condensation resin, wheat flour, and wheat gluten, said adhesive composition having a density less than water and is non-thixotropic. The composition is prepared by subjecting an aqueous formaldehyde condensation resin, wheat flour and wheat gluten to an intense high shear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.