Shock tolerant heat dissipating electronics package
US9404357B2 · kind B2 · utility
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18References
14Claims
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Key dates
| Filing date | Dec 22, 2010 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Dec 17, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49938
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.