Methodology and apparatus for testing conductive adhesive within antenna assembly
US9404842B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2013 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Jul 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B17/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.