Microstrip line of different widths, ground planes of different distances
US9405064B2 · kind B2 · utility
28Cited by
20References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2012 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Oct 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.