Image sensor modules including primary high-resolution and secondary imagers
US9405096B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 19, 2015 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Aug 19, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/0062
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic module includes one or more image sensors including photosensitive regions. The module includes a first imager including a first stack of beam shaping elements disposed over the image sensor(s) to direct incoming light to a first photosensitive region, and a second imager including a second stack of beam shaping elements disposed over the image sensor(s) to direct incoming light to a second photosensitive region. Each particular stack includes a respective high-dispersion beam shaping element, where the high-dispersion beam shaping element of the first stack forms part of an achromatic doublet at an object side of the first stack. The high-dispersion beam shaping element in the second stack is part of a laterally contiguous array of beam shaping elements that does not include the high-dispersion beam shaping element that forms part of the achromatic doublet at the object side of the first stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.