Heat sink for an interchangeable expansion module capable of being connected to a computer board
US9405338B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2011 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Jul 14, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for an interchangeable expansion module that can be connected to a computer board is disclosed. In one aspect, the heat sink has at least one cooling module in which a coolant flows, and at least one first electrical connector. The heat sink, wherein the expansion module has at least one second electrical connector configured to be connected to the first electrical connector of the board, and has at least one heat exchange surface, the heat sink comprising at least one heat-transfer device configured to be removably placed against the exchange surface, and the heat-transfer device further being configured such that it is in thermal contact with the cooling module and is mechanically attached, in a removable manner, to the cooling module of the board when the expansion module is connected to the board is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.