Full perimeter chemical strengthening of substrates
US9405388B2 · kind B2 · utility
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110References
18Claims
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Key dates
| Filing date | Sep 17, 2010 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Nov 9, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments, the sandwich in then immersed in a chemical strengthener. In other embodiments, a localized treatment is applied to the unstrengthened edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.