Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
US9406637B2 · kind B2 · utility
119Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2014 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Dec 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.