Flip chip light emitting diode packaging structure
US9406842B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2015 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Apr 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8583
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.