Optoelectronic semiconductor component, conversion-medium lamina and method for producing a conversion-medium lamina

US9406847B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Ales Markytan · Regensburg, DE
• Christian Gärtner · Greifswald, DE
• Hans-Christoph Gallmeier · Regensburg, DE
• Ion Stoll · Tegernheim, DE
• Herbert Brunner · Sinzing, DE
• Thomas Schlereth · Pentling, DE

Key dates

• Filing date: Jul 30, 2013
• Grant date: Aug 2, 2016
• Expiry date: Jul 30, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8513

Abstract

In at least one embodiment, the semiconductor component includes an optoelectronic semiconductors chip. Furthermore, the semiconductor component includes a conversion-medium lamina, which is fitted to a main radiation side of the semiconductor chip and is designed for converting a primary radiation into a secondary radiation. The conversion-medium lamina includes a matrix material and conversion-medium particles embedded therein. Furthermore, the conversion-medium lamina includes a conversion layer. The conversion-medium particles are situated in the at least one conversion layer. The conversion-medium particles, alone or together with diffusion-medium particles optionally present, make up a proportion by volume of at least 50% of the conversion layer. Furthermore, the conversion-medium lamina includes a binder layer containing the conversion-medium particles with a proportion by volume of at most 2.5%.