Microwave arrangement for the transmission of high-frequency signals
US9406992B2 · kind B2 · utility
2Cited by
3References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Oct 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/085
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The invention relates to a microwave arrangement for the transmission of high-frequency signals of high powers comprising a microstrip conductor on an upper side of a substrate. The microstrip line comprises a multi-stage signal splitter and a ground surface on an underside of the substrate disposed opposite to the upper side. A defected ground structure is introduced into the ground-surface below a first stage of the signal splitter. Further a power combiner and/or a power splitter with a microwave arrangement according to example embodiments of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.