Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration
US9407251B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2013 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Jan 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.