Build-up printed wiring board substrate having a core layer that is part of a circuit
US9408314B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 7, 2012 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Nov 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0959
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.