Electronic component having a molded component housing

US9408319B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Eberhard Haiss · Hechingen, DE
• Martin Rojahn · Lörrach, DE
• Matthias Taglieber · Lörrach, DE
• Thomas Schrimpf · Reutlingen, DE
• Matthias Ludwig · Lingen (Ems), DE
• Andreas Blum · Reutlingen, DE

Key dates

• Filing date: Dec 2, 2013
• Grant date: Aug 2, 2016
• Expiry date: Aug 22, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49117
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An electronic component having a molded component housing and an electrically conductive insert part embedded in the component housing for contacting a micro component, the insert part having an accommodating area for accommodating the micro component with a subarea, which is spaced apart from the micro component, for decoupling the micro component from material stresses of the component housing. A method for manufacturing an electronic component having a molded component housing, an electrically conductive insert part for contacting a micro component being embedded in the component housing, a subarea, which is spaced apart from the micro component, decoupling the micro component from material stresses of the component housing, during curing of the housing material, in an accommodating area for accommodating the micro component on the insert part.